Panwei Technology Co., LTD | Intro
Panwei Technology (Qingdao) Co., Ltd. is a comprehensive high-tech development enterprise, committed to
the scientific research and technology development produced by the practical value of the scientific and
technological achievements of the follow-up test, development, application, promotion until the
formation of new products, new processes, new materials, and then industrialization, and finally reach
the corresponding field of advanced level.
The company has independent research and development of "advanced metal base superhard abrasive tools
development and production platform".
The effective chemical metallurgical connection of superhard abrasives and alloy brazing filler metal
was realized by using metal base brazing binder technology for CBN and diamond. The production of metal
bond diamond and CBN superhard grinding wheels can be widely used in carbide cutting tools, automotive
crankshaft and camshaft, aerospace engine high-precision manufacturing and rail transit market. This
product breaks the foreign technology monopoly and can meet the high precision grinding requirements of
aerospace engine blades...
Products
Technical Background
The new generation of porous metal binder process is based on
self-developed high performance alloy system, using advanced metallurgical process without adding any
The porous structure products sintered under the condition of pore-making agent, abrasives and binders
produce effective chemical metallurgical combination compared with the traditional physical embedding
structure greatly improve the retention force and exposure rate, while the porous structure of good
heat dissipation capacity and easy dressing doubled to reduce the sharpening and dressing frequency
can even
Do not need to sharpen within the dressing cycle, and greatly improve the processing efficiency and
service life.
Technological Innovation
As a platform technology, the effective chemical connection between
abrasive, binder and metal matrix is realized, with high bonding strength.
In the large load, high speed and high efficiency grinding, it can firmly hold the abrasive particles,
good heat dissipation, the exposed height of the abrasive particles can reach 70%~80%, which increases
the space of chip containing, the grinding wheel is not easy to plug, the utilization of abrasive
materials is more full, and easy to dress.
1. Improve the service life of abrasive tools by 35%
The grinding accuracy reaches 0.025 micron. 2, greatly reduce the sharpening and dressing frequency.
3. Grinding accuracy reaches 0.025 micron
. 4. Increase the grinding speed by 2-3 times.
Technical Background
The new generation of porous metal binder process is based on
self-developed high performance alloy system, using advanced metallurgical process without adding any
The porous structure products sintered under the condition of pore-making agent, abrasives and binders
produce effective chemical metallurgical combination compared with the traditional physical embedding
structure greatly improve the retention force and exposure rate, while the porous structure of good
heat dissipation capacity and easy dressing doubled to reduce the sharpening and dressing frequency
can even
Do not need to sharpen within the dressing cycle, and greatly improve the processing efficiency and
service life.
Technological Innovation
As a platform technology, the effective chemical connection between
abrasive, binder and metal matrix is realized, with high bonding strength.
In the large load, high speed and high efficiency grinding, it can firmly hold the abrasive particles,
good heat dissipation, the exposed height of the abrasive particles can reach 70%~80%, which increases
the space of chip containing, the grinding wheel is not easy to plug, the utilization of abrasive
materials is more full, and easy to dress.
1. Improve the service life of abrasive tools by 35%
The grinding accuracy reaches 0.025 micron. 2, greatly reduce the sharpening and dressing frequency.
3. Grinding accuracy reaches 0.025 micron
. 4. Increase the grinding speed by 2-3 times.


